MicroLED firms pivot to Co-Packaged Optics for AI data centers at Eindhoven conference

At the September MicroLED and AR/VR Connect conference in Eindhoven, a notable shift emerged as many MicroLED companies emphasized optical interconnects and Co-Packaged Optics (CPO) for AI data centers. The event, which has grown 20–30% annually, also featured discussions on optical see-through (OST) augmented reality. Panelists noted that green-only MicroLEDs currently dominate small, ~30° field-of-view products, primarily used in Asia for English translation. However, full-color MicroLED solutions remain challenged by size and cost constraints compared to LCOS. Additionally, concerns were raised regarding the manufacturing friction of integrating prescriptions into AR glasses and skepticism toward claims that $100 component costs are necessary to reach 100 million units.